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Description
Syringe Tin Solder Pasteis a new type of solder material that comes with SMT. Adapted to the mobile phone repair industry. computer digital service sectors and high-precision circuit board soldering SMT/BGA soldering processes. Use of efficient energy thixotropic agents. printing and preheating collapse. unique solder ensure a good printing and fine pattern. At room temperature. it is wetting. anti-drying. and has a relatively long shelf life.
Features
Smart Design: New technological support. unique chemical formula provides good wetting. to ensure high reliability.
PCB/BGA Dedicated: High-end quality. a unique formula. flawless performance. easy to weld. solder bond is brilliant and full. no weld. false welding phenomena.
Widely Applicable: The residue is colorless and transparent. does not interfere with detection. is disposable. and cleans well.
Revolutionary Durability: High-quality solder paste with a delicate look. fine and flexible packaging (10 cc/support).
How to Use
Open the Lid by turning it counterclockwise.
Install the needle from the package include.
Open the protective cover and install the push rod.
